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INVENTION
Russian Federation Patent RU2278886
Thermosetting hot melt adhesive
The applicant's name: Limited Liability Company "Bridge-1" (RU)
Name of the inventor: Viktor Erchenkov (RU); Maksutova Gelnara Shamilevna (RU); Salyukov Viacheslav (RU); Veliyulin Ibrahim Ibrahimovic (RU); Rasstrigin Ivan Ivanovich (RU); Krylov Evgeny (RU); Trigub Vladimir (RU)
The name of the patentee: Limited Liability Company "Bridge-1" (RU)
Address for correspondence: 125368, Moscow, p / 84 AA board room
Starting date of the patent: 2005.04.25
The invention relates to the field of adhesives, specifically to the field of thermosetting adhesives - melts and can be used as the adhesive layer in the heat-shrinkable and repair products, at en-route and a factory pipe coating for corrosion protection of pipelines and products cable industry, but also in making repairs underground structures. An object is to simplify and reduce the cost of works on the adhesive connection of various elements, particularly when applying protective coatings on metal constructions in the field by reducing the curing temperature and non-adhesive surface cleaning operations metal structure. The problem is solved in that the adhesive comprises ethylene vinyl acetate copolymer, Mica ground, low molecular weight polyisobutylene, atsetonanil-P.
DESCRIPTION OF THE INVENTION
The invention relates to the field of adhesives, specifically to the field of thermosetting adhesives - melts and can be used as the adhesive layer in the heat-shrinkable and repair products with en-route and a factory pipe coating for corrosion protection of pipelines and products cable industry, but also in the repair of underground structures.
Further, the following terms will be used when describing the invention:
- low molecular weight - with respect to the used component of this term has the meaning given in the monograph A.M.Shur. Macromolecular compounds. M., "High School", 1981, page 8;
- stabilizer - a component used in relation to this term has the meaning given in the handbook "Great Encyclopedic Dictionary. M., "Chemistry", "Great Russian Encyclopedia", 1998, str.539 ( "polymer stabilizers" section;
- antioxidant - in relation to the used component of this term has the meaning given in the handbook "Great Encyclopedic Dictionary. M., "Chemistry", "Great Russian Encyclopedia", 1998, p.50.
Known adhesive - melt (SU, Inventor's Certificate 1654324) comprising an ethylene-vinyl acetate copolymer with a vinyl acetate content of 27-33% by weight of groups, tackiness agent, a plasticizer and waxes based on synthetic wax -. Macromolecular esterification product of natural or synthetic fatty monoethanolamides of synthetic fatty acids acids fraction C 10 -C 16.
The disadvantage of this melt is necessary to recognize a low resistance at low temperatures and poor adhesion to metal surfaces.
Known and the hot melt adhesive (US, Patent 3,896,069, 1975), comprising an ethylene vinyl acetate copolymer, paraffin, and asfaltobitumnye resin.
Known hot melt adhesive does not adhere to metal surfaces.
Known hot melt adhesive (SU, Inventor's Certificate 929677, 1982), comprising a copolymer of ethylene with vinyl acetate, thermoplastic divinilstirolny secondary polyethylene, rosin and polyethylene wax.
Known hot melt adhesive does not adhere to metal surfaces.
Known hot melt adhesive (RU, patent 2015152) containing acetylene and vinyl acetate copolymer, rosin-modified glycerol ester, incomplete esterification product of diethylene glycol with rosin acid number of 50 - 80 mg KOH / g, and a filler.
Known hot melt adhesive does not adhere to metal surfaces.
Known hot melt adhesive (RU, patent 2112005) comprising an ethylene-vinyl acetate copolymer, vinyl acetate is preferably 5-24 wt.%, Butadiene-styrene thermoplastic elastomer, a rosin glycerine ester, paraffin, terpene oil, and stabilizer.
The disadvantage of hot melt adhesive should be recognized poor adhesion to metals and low and stable over time.
Known hot melt adhesive (SU, Inventor's Certificate 665701) containing ethylene vinyl acetate copolymer with vinyl groups at a content of 10-30%, the adhesive additive, a plasticizer, and polyethylene oxide with a molecular weight of 750000-1000000.
The disadvantage of hot melt adhesive should recognize low strength at low temperatures.
The closest analogue of the proposed hot melt adhesive composition can recognize (RU, Patent 2143451) comprising a copolymer of ethylene and vinyl acetate and a product comprising amorphous silica. The well-known hot melt adhesive for adhesive bonding of various substrates in aviation, mechanical engineering, electronics, electronics, furniture industry, production of container and at home.
The disadvantage of hot melt should be recognized as a weak adhesion to the oxidation of the metal.
The technical problem to be solved by the proposed application of the adhesive, the adhesive is to develop a composition curable at a low temperature and having adhesion to the oxidized metal surface.
The technical result obtained in the implementation of the proposed structure, is to simplify and reduce the cost of works on the adhesive connection of the various elements, especially when applying protective coatings on metal constructions in the field by reducing the temperature curing adhesive and non-stripping operations surface of the metal structure.
To achieve the specified technical result is proposed to use a composition comprising an ethylene-vinyl acetate copolymer (Sevilen) Mica ground, low molecular weight polyisobutylene, atsetonanil-P in the following ratio (wt.%):
Sevilen component meets the specifications set out in TU 6-05-1636-97. Savile. Sehvilena adhesive composition. " Useful mica particles have an average size of about 20-50 microns. Atsetonanil P represents tackiness agent.
This ratio of components provides a glue adhesive having light- and heat-resistant structure which has high adhesion to the metal surface and cured at a temperature of 70 ° C. The finished product may be in the form of pellets or in the form of a rod.
hot melt adhesive manufacturing technology (adhesive) is traditional and as a compulsory operation involves mixing molten surgery (softened) sehvilena with other components followed by granulating the resulting mixture.
In the future, the proposed composition of the hot melt adhesive will be discussed using examples of implementation.
1. Hot melt adhesive contains components in the following ratio (wt.%):
The resulting hot melt showed the following results in the tests:
a). Adhesion (N / cm) Standard 411 (when peeling speed of 10 mm / min):
b). Melt flow rate (g / 10 min) (in accordance with GOST 11645) at a load of 21.17 N, nozzle diameter of 2,095 mm, a temperature of 125 ° C after soaking the sample for 5 minutes was 31.
at). Melt temperature (polymerization) 50 ° C.
g). The temperature of application to a solid substrate (steel) 68 ° C.
2. Hot melt adhesive contains components in the following ratio (wt.%):
The resulting hot melt showed the following results in the tests:
a). Adhesion (N / cm) Standard 411 (when peeling speed of 10 mm / min):
b). Melt flow rate (g / 10 min) (in accordance with GOST 11645) at a load of 21.17 N, nozzle diameter of 2,095 mm, a temperature of 125 ° C after soaking the sample for 5 minutes was 31.
at). Melt temperature (polymerization) 52 ° C.
g). The temperature of application to a solid substrate (steel) 71 ° C.
3. Hot-melt adhesive contains components in the following ratio (wt.%):
The resulting hot melt showed the following results in the tests:
a). Adhesion (N / cm) Standard 411 (when peeling speed of 10 mm / min):
b). Melt flow rate (g / 10 min) (in accordance with GOST 11645) at a load of 21.17 N, nozzle diameter of 2,095 mm, a temperature of 125 ° C after soaking the sample for 5 minutes was 27.
at). Melt temperature (polymerization) 54 ° C.
g). The temperature of application to a solid substrate (steel) 73 ° C.
4. Hot melt adhesive contains components in the following ratio (wt.%):
The resulting hot melt showed the following results in the tests:
a). Adhesion (N / cm) Standard 411 (when peeling speed of 10 mm / min):
b). Melt flow rate (g / 10 min) (in accordance with GOST 11645) at a load of 21.17 N, nozzle diameter of 2,095 mm, a temperature of 125 ° C after soaking the sample for 5 minutes was 14.
at). Melt temperature (polymerization) 89 ° C.
g). The temperature of application to a solid substrate (steel) 97 ° C.
This composition does not achieve the said technical result.
5. Hot melt adhesive contains components in the following ratio (wt.%):
The resulting hot melt showed the following results in the tests:
a). Adhesion (N / cm) Standard 411 (when peeling speed of 10 mm / min):
b). Melt flow rate (g / 10 min) (5 to GOST 1164) under a load of 21.17 N, nozzle diameter of 2,095 mm, a temperature of 125 ° C after soaking the sample for 5 minutes was 16.
at). Melt temperature (polymerization) 80 ° C.
g). The temperature of application to a solid substrate (steel) 103 ° C.
Said composition does not achieve the said technical result.
As implementation of the above examples used an ethylene-vinyl acetate copolymer ( "Sevilen") with a vinyl acetate content of 24.6 wt.%, Similar results were obtained using the preparation "Sevilen" brand 11306-075, 11104-030, 11507-375 with vinyl acetate content of 26 up to 30 wt.% (see. above 6-05-1636-97 TU).
Atsetonanil- P component is 2,2,4-trimethyl -1,2 digidroksihinolin (see. SU, Inventor's Certificate 1388411).
The term "low molecular weight polyisobutylene" describes a substance having a molecular weight (determined by Staudinger) 10000-50000. In the examples of using low molecular weight polyisobutylene brand P-20 (molecular weight approximately equal to 15000-20000).
it was found that only when using all of these in the claims the components within the above ranges of content provided by the achievement of the said technical result during experimental testing of the proposed composition - simplification and cheapening of works on the adhesive connection of various elements, particularly when applying protective coatings on metal constructions in the field of by lowering the temperature curing adhesive operations and the lack of stripping the surface of the metal structure.
CLAIM
Hot melt adhesive comprising an ethylene-vinyl acetate copolymer, characterized in that it further comprises milled mica, low molecular weight polyisobutylene and atsetonanil-P in the following ratio, wt.%:
print version
Publication date 03.12.2006gg
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