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INVENTION
Patent of the Russian Federation RU2121531
METHOD OF PRODUCING THINSHOT DETAILS
Applicant's name: Closed Joint-Stock Company "Techpro"
The name of the inventor: Kryshchenko KI; Borisov MB; Odintsov LG; Dzegylenok VN; Neiland A.B.
The name of the patent owner: Closed Joint-Stock Company "Techpro"
Address for correspondence:
Date of commencement of the patent: 1995.04.05
Refers to mechanical engineering, to galvanic production, and can be used in galvanic shops of various profiles in the manufacture of parts of radio electronics, parts of the optical and mechanical industry, jewelry, icons, etc. The aim of the invention is to shorten the manufacturing cycle, reduce the cost, improve the accuracy and quality of manufacturing. The essence of the method consists in galvanic deposition of metal on a special matrix. New is the fact that the matrix is formed from the drawing, photo or drawing of the part by computer processing with the necessary corrections due to the patterns of the matrix and the electroforming process, then a photomask is produced from the computer drawing, and then a printing tool, then special paints active to the process This paper is printed on a dielectric substrate (paper, polyethylene, plastic, etc.) with a single-use die, metallizes the drawing and galvanically deposits the metal in one layer or in several dissimilar layers, then the part is separated from the matrix, and when it is produced, for example, PCB parts from the matrix are not separated, but the fact that the pattern can be made negative, and as a basis, materials containing chemical catalysts are used. It is also new that, after drawing the pattern, the matrix is formed by vacuum, thermal or other method with a profile height of up to 5 mm, with a curvature radius of no more than 2 mm or before drawing the pattern; in the latter case, the pattern is applied by a tampography method.
DESCRIPTION OF THE INVENTION
The proposed method relates to mechanical engineering, to galvanic production, and can be used in galvanic shops of various profiles in the manufacture of parts of radio electronics, parts of the optical and mechanical industry, jewelry and other similar products.
At present, openwork parts with a thickness of 0.05-0.5 mm are manufactured either by stamping out of precision rolled products according to environmentally harmful technology with a long, expensive production preparation cycle, including designing and manufacturing dies, or they are produced by galvanic deposition on an expensive matrix (A. USSR N 641008, MKL D 1/00, 1971: N 834858, MKL C 25 D 1/00, 1981, N 700565, MKL C 25 D 1/00, 1975: N 945251, MKL C 25 D 1/02, 1982, and others) .
The closest prototype of the proposed method is the technical solution for A. s. USSR N 789637 "Galvanoplastic method for manufacturing planar perforated parts", MKL C 25 D 1/08, 1978. This method involves an expensive long-term matrix manufacturing process, as well as a complex process of its removal.
The purpose of the proposed method for producing thin-walled delicate details by galvanic deposition of metal on a special matrix, followed by separation of the part from it or without separation of the part, is the reduction of the manufacturing cycle of the matrix and the part as a whole, reducing the cost of production, improving accuracy and manufacturing quality.
This goal is achieved due to the fact that the matrix is formed from the drawing, photo or from the figure of the part by computer processing with the necessary corrections due to the regularities of the matrix manufacturing process and the electroforming process, then a photomask is made from a computer drawing, and then a typographic tool, With paints active to the process of chemical metallization, this tool prints on a dielectric substrate (paper, polyethylene, plastic, etc.) a drawing of a disposable matrix, metallizes the pattern and galvanically deposits the metal in one layer or in several dissimilar layers, and then separates the parts from the matrix; Due to the fact that when receiving, for example, printed circuit boards, the part from the matrix is not separated; Due to the fact that the pattern is performed negatively, the materials used in the composition of which are introduced are chemical metallization catalysts; Due to the fact that after applying the pattern, the matrix is formed by a vacuum, thermal or other method with a profile height of up to 5 mm and a radius of curvature of not more than 2 mm; But also due to the fact that the matrix is formed before the drawing, and the pattern is applied by the method of tampography.
The essence of the proposed method is as follows. Drawing, drawing or photo of the manufactured part is entered into the computer and processed according to a special program providing its editing (excluding secondary elements for this part, etc.). At the same time, elements are introduced to ensure a uniform current supply and optimal distribution, for example, several small details on the surface of the matrix (with the simultaneous manufacture of several parts), and correcting the figure, taking into account the distortions introduced by the formation (printing) of the drawing and the electroforming process itself, i.e. Pre-distortion is introduced. The graphic image is multiplied and gets a complete look with all subsequent steps taken into account. The surface of the pattern and all its elements are measured and the parameters of the electroforming are calculated. Next, a photomask is produced on the printout, and a typographic tool (offset roller, mesh stencil, molds for tampon printing, etc.) is produced on it. Then the resulting graphic drawing with a special ink is printed on paper, film, plastic or on any other dielectric, with the number of copies practically unlimited. The ink used for printing should have the ability to catalyze the process of chemical metallization, and the substrate should not have this ability or vice versa. The dielectric film is metallized with a special compound and results in a disposable matrix.
After that, the matrix is installed in a galvanic bath, connected to a power source and the process of "building up" (depositing) the metal to the required thickness in one layer or in several dissimilar layers is carried out, and the substrate is then mechanically removed. It peels off with a light touch (if it is paper or film). When manufacturing, for example, printed circuit boards, a stronger and stiffer substrate remains (not separated), which is due to the very design and purpose of the product. The separated parts are subjected to final finishing if necessary, depending on the material of the part, its dimensions and purpose.
A FEW EXAMPLES
The part drawing is entered into the computer with the help of a scanner, a fax modem from a floppy disk or other known method, graphically editing a drawing (changing the scale to the required one, introducing a compensation distortion that further excludes the actual distortion on the printed and galvanic technological operations), multiply the figure in the case Making several parts on one matrix, forming current-carrying elements and elements, providing separation of the part from the technological part of the workpiece, obtained by electroforming. The formed matrix drawing in real scale is used as a template for manufacturing a printing element (stencils, photomasks, etc.), which are obtained by conventional known methods. Disposable matrices (their number is practically unlimited) are printed on dielectric film material (lavsan film, paper, cardboard, etc.) with special paint (printing on both sides is allowed). Special ink differs from conventional ink for printing in that in Its composition instead of usual fillers in an amount of 20-50% of the weight composition (without taking into account the solvent), finely dispersed pigmentary titanium oxide activated by palladium (palladium content 0.01-0.04% by weight) is introduced. Before weighing in a galvanic bath, the pattern of the matrix is coppered in a special solution, then the matrix is fixed mechanically on a rigid suspension or with an adhesive resistant to the conditions of applying the metal coating and connected to an electric current source. The build-up, for example, of a nickel component is conducted from the sulfate nickel electrolyte. Upon reaching a predetermined thickness, the matrix with the grown part is washed with water, dried and mechanically separated from the matrix and from the processing part. As already noted, the thickness of the part lies in the range of 0.05-0.5 mm (depending on the growing time), its maximum dimensions are limited only by the dimensions of the matrix and galvanic bath. It is possible to form infinite structures, in this case the base-matrix with the pattern is rolled into a roll with a gap of 2 to 3 mm, which is rewound from one position to another, and the matrix passes a metallization or galvanic bath between them, where the build-up is performed at a given rate. When receiving the matrix in this case, not screen printing is used, but offset printing. The surface roughness P 0 of the obtained part from nickel on the front side is 0.1-0.16 μm, the hardness is 5-6 GPa, the tensile strength is 0.7 - 1.25 GPa. The shape of the hole on the part can be any, the minimum width of the holes (gaps) is up to 50 microns, with a smaller distance between adjacent edges the holes can overgrow when metal is deposited. To obtain products from other materials and from complex metal compositions, use the corresponding known electrolytes used in electroforming.
The method makes it possible to obtain not flat but curvilinear surfaces with a profile height of no more than 5 mm, with a radius of curvature of at least 2 mm, and spatial shell structures. Based on the results of the experiments performed, it is established that the possibilities of this method are limited by the specified parameters in terms of curvature: if the profile height is more than 5 mm and the radius of curvature is less than 2 mm, then the electroforming process becomes uncontrollable, the accuracy of the part dimensions is sharply reduced. When producing curvilinear surfaces, the pattern is printed on a film suitable for molding, for example, by a vacuum or thermal method. After applying the pattern, the matrix is molded and then expanded. The operation of forming the matrix can be performed before the drawing, and the pattern on the molded matrix is applied by tampography. It is also possible to obtain shell-like spatial thin-walled openwork designs of practically any size, in which the carrier can be easily removable material or inflatable shells, and the pattern on them is applied with the specified special paints.
In addition to finely dispersed titanium oxide activated by palladium, tin dioxide, aerosil and other compounds activated by grafting cluster complexes of two or more metals of variable valency (tin and palladium, tin and platinum, iron and copper, tin and Silver, titanium and silver, tin and nickel-copper, etc.), which have organic ligands on the outer surface of the base metal of the cluster complex, capable of reacting recrystallization (ligand substitution) in an aqueous medium.
A particular area of use of the method is a variant where the pattern is made negative and materials are used as the basis, the chemical metallization catalyst is introduced into the composition by known methods. In this case, the printing is done by an ordinary, stand-up in the conditions of electrotype printing ink. With the build-up of metal, the entire free space is formed between the lines of the pattern. The following technology applies to varieties of this variant. The pattern is printed by a laser printer on paper or on another porous sheet dielectric, then the sheet with a print on the backside is wetted with a solution of acetic copper (20-60 g / l), laid out on a glass soaked in water and dried in air until it falls behind the glass, Copper is concentrated in the upper layer of the gaps of the pattern. The dried sheet is placed sequentially into a chamber with ammonia and with formalin, dried in air or by soaking, while particles of copper or cuprous oxide are formed. The matrix with copper-plated pattern is glued on a rigid substrate with wax, paraffin or other persistent material under electroforming conditions. Next, galvanic molding of the part is carried out in the usual way.
The conduction of electrical conductivity to the gaps of the pattern can be achieved by other methods, there are many of them: impregnation with salts of tin and palladium, titanium and silver, etc.; Impregnation with adhesives, adhesive melts, various polymerizable liquids followed by application of the dust-like conductors on the face side, curing the binder and removing the layer from the pattern printed by the laser printer,
When manufacturing printed circuit boards, patch panels, screens, metal inlays, art products and other similar parts, they are not separated from the matrix-matrix, otherwise all operations are performed as indicated above.
The proposed method was tested in the manufacture of printed circuit boards, tracery electronic parts, art products, etc. It is established that the terms of preparation of production using this method are reduced in tens and hundreds of times: instead of 4 to 6 months, a new product can be mastered in a few days. This is due to the fact that there is no need to design and manufacture dies, tools, equipment, etc., since The method is realized on universal galvanic equipment, on universal printing devices using conventional computer technology.
CLAIM
A method for producing thin-walled parts, comprising forming a matrix, metallizing a pattern, and galvanically depositing a metal, characterized in that the matrix is formed by manufacturing a photomask according to a computer pattern of the part, taking into account the prediction, and a typographic tool is made from the photomask, and then using a dielectric substrate tool Print a drawing of the disposable matrix with dyes active in the process of chemical metallization, and the galvanic deposition of the metal is carried out in one layer or several dissimilar layers.
2. A method according to claim 1, characterized in that the pattern of the disposable matrix is negative, and materials containing catalysts for chemical metallization are used as the dielectric substrate.
3. A method according to claim 1, characterized in that after printing the pattern, the disposable matrix is additionally formed with a profile height of up to 5 mm and a radius of curvature of not more than 2 mm.
4. The method of claim 1, wherein the dielectric substrate is further formed prior to application of the ink, and the ink is applied by tamponography.
print version
Date of publication 09.12.2006гг
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